Intel is rolling out two Core i3 chips for notebooks and Ultrabooks, while AMD is adding to its lineup of Embedded G-Series APUs.
Intel and Advanced Micro Devices continue to
fill out their respective chip lineups for low-power systems.
Intel this week reportedly introduced a pair
of third-generation Core i3 chips for the mobile market, while rival AMD unveiled
its latest Embedded G-Series accelerated processing unit (APU) for small-form-factor
embedded designs that call for very low power and low costs.
According to the
Fudzilla Website, Intel rolled out the Core i3-3110M and i3-3217U,
both dual-core processors based on the Ivy Bridge architecture and built on the
chip makers 22-nanometer manufacturing process. They also both feature Intels
HD 4000 graphics and Hyper Threading technologies.
The i3-3110M is aimed at mainstream notebook
PCs, and is clocked at 2.4GHz. It offers 512MB of L2 and 3MB of L3 cache,
dual-channel double data rate type 3 DDR3-1600 memory and a 35-watt thermal
design power (TDP). The Core i3-3217U is an ultra-low-power chip that consumes
17 watts, looks to be designed more for
Ultrabooks,
new very thin and light notebook designs championed by Intel. It has a speed of
1.8GHz and the same L2 and L3 characteristics of the i3-3110M.
Intel executives expect the new Ivy Bridge
processors being rolled out this year to fuel design wins and customer adoption
of the Ultrabooks, which are designed to offer the same productivity
capabilities of traditional laptops along with features normally found in
tablets, including long battery life, instant-on and constant-connectivity
capabilities, and in some cases touch-screens. Almost two-dozen Ultrabooks
powered by last years 32nm Sandy Bridge chips are on the market, and Intel
officials said they expect more than 100 designs this year based on Ivy Bridge.
For its part, AMD is rolling out the G-T16R
embedded chip for systems looking to combine x86 computing capabilities and
graphics. The chip consumes 2.3 watts on average, a level of energy efficiency
that is in demand for such systems in such areas as industrial control,
point-of-sale, medical appliances and transportation, according to AMD
officials.
With the AMD G-T16R APU, we were striving
for that critical balance of performance, power efficiency and cost for power,
and cost-sensitive embedded applications, and weve achieved it, Arun Iyengar,
corporate vice president and general manager for AMDs Embedded Solutions unit,
said in a statement. This new APU helps to enable small-form-factor and
fan-less designs with power consumption of just 2.3 watts on average.
AMD officials said the chip offers a strong
upgrade path for legacy applications, a key feature for embedded system designers.
The chip fits into small-form-factor boards with a two-chip implementationthe
APU and a companion controller hub. In addition, the chip supports legacy I/O
cards as well as multiple display technologies, from analog VGA and Low-Voltage
Differential Signaling (LVDS) for legacy applications to Digital Video
Interactive (DVI), High-Definition Multimedia Interface (HDMI) and DisplayPort
interfaces for the newest display technologies.
Those companies using AMDs Geode LX chip
family also can easily upgrade to the G-T16R, which consumes 7 percent less
power and offers three times the performance of the Geode LX and its 2.45
watts, and all in a chip footprint that is 58 percent smaller.
AMD officials also said they are extending
the availability of their entire Embedded G-Series chips through 2017, which is
important to designers since embedded systems tend to have a longer life than
traditional PCs and servers.
The chip maker has aggressively pursued the
embedded market, creating not only the G-Series but also, in May, unveiling the
Embedded
R-Series lineup based on the new Trinity design and offering as many as
four cores.
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