Asetek Fights Data Center Heat With Liquid Cooling
Advances in cooling may bring data center operating costs down, while extending the life of components.Heat is one of the biggest enemies in the data center, with the potential to cost both an enterprise and an IT department a lot of money. Heat generation in the data center contributes to system failures, reduces component life, increases environmental control costs and can be difficult and expensive to mitigate. Hardware vendor Asetek is hoping to take the bite out of controlling heat with liquid cooling.
"While much of what is written suggests that the problem of data center cooling is monolithic, we have discovered the need is for a diverse set of solutions to meet specific data center performance, density and efficiency objectives," said Asetek CEO and founder Andr??Â« Sloth Eriksen. "Using proven Asetek technology to engineer a range of cooling solutions gives Asetek a unique ability to address the wide diversity of cooling challenges that exist in the HPC and data center market today."
- Internal Loop Liquid Cooling, which enables the use of the fastest processors, including high-wattage processors,in high density servers.
- Rack CDU Liquid Cooling, which removes processor or GPU heat from rack servers and blades from the data center without the use of traditional computer room air conditioners or water chillers. This enables extreme densities on server, rack and data center level. The strongest value proposition however, is that the solution uses free, ambient air cooling, which creates a 50 percent power savings within the data center.
- Sealed Server Liquid Cooling, which removes all server heat from the data center through liquid. With this technology, no air from inside the data center is used for server cooling. Instead, the solution enables high density with high performance processors and ambient room temperature server cooling.