IBM, Samsung to Show Next-Gen Chip Tech at March Event
IBM, Samsung and GLOBALFOUNDRIES—founders of the Common Platform alliance—will showcase next-generation chip technologies at the Common Platform Technology Forum in March.IBM, Samsung Electronics and GLOBALFOUNDRIES will preview the future of silicon technology at the 2012 Common Platform Technology Forum to be held at the Santa Clara Convention Center March 14. The companies are the founders of the Common Platform technology collaboration, which is the world's largest chip-making consortium, IBM officials said. At the upcoming forum, the companies will address next-generation semiconductor innovation covering topics such as 28-, 20- and 14-nanometer processes, as well as innovations beyond 14nm and 450mm wafer manufacturing. Technology jointly developed by the Common Platform companiesincluding more than 20 additional member companiespowers the majority of the world's mobile devices and consumer electronics, IBM said
The Common Platform alliance is built upon an unmatched legacy of invention and deep commitment to research and development from IBM, said Michael Cadigan, general manager of IBM's microelectronics division, in a statement. The expertise of the companies is driving breakthrough technology innovations for semiconductor manufacturing. Our extensive and open ecosystem, focused on core manufacturing capabilities, gives our customers a flexible way to bring a wide range of semiconductor products to market.
An FAQ on the Common Platform alliance site says the Common Platform technology enables a single design to be multi-sourced so that customers receive the benefits of:
- collective innovation and access to application-ready, leading-edge process technologies;
- capacity that is synchronized across fabs;
- sourcing flexibility and choice for single design, multi-fab engagements;
- quality assurance;
- faster ramp support with risk mitigation for high-volume applications; and
- insurance against the risk of expensive redesign or manufacturing disruption.