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IT & Network Infrastructure : IBM Using DNA to Build Next-Generation Chips

By Jeffrey Burt on 2009-08-17


With chip makers such as IBM and Intel aiming to shrink the manufacturing process to 22 nanometers and smaller, the push is on to develop ways to improve performance and energy efficiency. Scientists with IBM Research and the California Institute of Technology are working on ways to use DNA molecules as the basis for building tiny circuit boards. As shown in these images from IBM Research, the DNA can be put into various shapes and used as a sort of scaffolding, where millions of nanotubes can be deposited onto the sticky DNA and then self-assemble into the precise patterns. IBM scientists say the DNA process can be used to increase performance, speed and energy efficiency in microchips, where feature sizes are 22 nm or smaller, and that these next-generation microprocessors can be less expensive to manufacture.

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IBM Using DNA to Build Next-Generation Chips

by Jeffrey Burt

Binding

In this image, low concentrations of triangular DNA origami are binding to wide lines on a lithographically patterned surface.

Triangular DNA Origami

High concentrations of triangular DNA origami are binding to wide lines on a lithographically patterned surface. The inset in the image shows individual origami structures at high resolution.

Sticking to the Template

Individual triangular DNA origami adhering to a template with properly sized triangular features.

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