Fujitsu Announces New WiMax Chip
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The baseband product is designed to show significant performance improvements over competing products in the WiMax chip market.
LAS VEGAS—Fujitsu Microelectronics America is announcing the companys first mobile silicon on chip WiMax product at Interop in Las Vegas. The baseband product, affectionately known as the MB86K21 802.16e, is designed to show significant performance improvements over competing products in the WiMax chip market. The company will start shipping samples in August.
Click here to read more about Fujitsus AMD-based notebook. The new device meets all requirements for the WiMax Forum Wave 2 mobile device certification. It supports 5 and 10 MHz channel bandwidths, has a variety of adaptive modulations modes and has security support built in. The product will support USB 2.0 and Card Bus / PCI host interface support.
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Wayne Rash is a Senior Analyst for eWEEK Labs and runs the magazine's Washington Bureau. Prior to joining eWEEK as a Senior Writer on wireless technology, he was a Senior Contributing Editor and previously a Senior Analyst in the InfoWorld Test Center. He was also a reviewer for Federal Computer Week and Information Security Magazine. Previously, he ran the reviews and events departments at CMP's InternetWeek.He is a retired naval officer, a former principal at American Management Systems and a long-time columnist for Byte Magazine. He is a regular contributor to Plane & Pilot Magazine and The Washington Post.
