Intel, DoCoMo to Co-Develop 3G Handset Chips

By eweek  |  Posted 2003-11-16 Print this article Print

NTT DoCoMo and Intel agree to develop semiconductors for 3G

NTT DoCoMo Inc. and Intel Corp. have agreed to develop semiconductors for 3G phones. The energy-efficient, low cost chips will carry out multiple tasks including image processing and data transmission. The companies will also jointly develop technology for fourth generation service, which is expected to be available as early as 2010.

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