IBM Intros Cloud Services for Designing Chips for Mobile, Wearables
IBM's High Performance Services for Electronic Design Automation (EDA) help small and midsize businesses and startups design chips faster.IBM today announced plans to deliver its IBM High Performance Services for Electronic Design Automation (EDA). Big Blue designed the new cloud service, which will provide on-demand access to electronic design tools, in partnership with SiCAD, a Silicon Design Platform provider, with expertise in EDA, design flows, networking, security, platform development and cloud technologies. "The proliferation of smartphones, tablets, wearable devices and Internet of things (IoT) products has been the primary driver for increased demand for semiconductor chips," Jai Iyer, founder and CEO of SiCAD, said in a statement. "Companies are under pressure to design electronic systems faster, better and cheaper. A time-based usage model on a need-basis makes sense for this industry and will spur innovation in the industry while lowering capital and operations expenses." The service is delivered on IBM's SoftLayer infrastructure supporting a pay-as-you-go model that opens up IBM-patented tools—that were previously used exclusively by IBM Microelectronics—to other electronics and semiconductor companies. In fact, IBM's EDA tools have been used to bring more than 100 projects to market, including IBM mainframe and Power microprocessors, interconnects, application-specific integrated circuits (ASICs) and custom projects, the company said.
In the first phase of the launch, IBM will deliver three key tools, IBM Library Characterization to create abstract electrical and timing models required by chip design tools and methodologies; IBM Logic Verification to simulate electronic systems described using the VHDL and Verilog design languages; and IBM Spice, an electronic circuit simulator used to check design integrity and predict circuit behavior.