ARM Unveils Chip Cores for Immersive Applications Like VR, AR
The chip designer is rolling out the Mali-V61 VPU and Mali-G51 GPU to address the demand from Generation Z members for more interactive devices.ARM is rolling out two chip cores that address the demand for greater immersive and interactive visual capabilities—including virtual and augmented reality—in their mobile devices. The company, which designs low-power chip architectures and then licenses those designs to such chip makers as Qualcomm and Samsung, on Oct. 31 unveiled the Mali-V61 video processing unit (VPU) and Mali-G51 GPU, which officials said will bring a greater visual experience to mobile devices, something that members of Generation Z are demanding. "The cost and visual experience a device delivers are key purchasing factors for Generation Z and mainstream mobile users," James McNiven, general manager for CPU and media processing groups at ARM, said in a statement. "Our latest Mali video and graphics IP suite meets this demand by offering immersive VR [virtual reality], gaming and compliance with real-time video standards." Both VR and augmented reality (AR) are focuses of device and component makers, with a lot of the headsets being tied to smartphones and other mobile systems. A report issued earlier this year by market research firm Strategy Analytics found that the worldwide VR headset market will hit about $895 million this year. However, while the bulk of those revenues—77 percent—will come from such high-end systems from Oculus, HTC and Sony, those will only account for 13 percent of the 12.8 million VR headsets expected to be sold in 2016. The rest will come from lower-priced headsets from multiple vendors.
At the Computex 2016 show earlier this year, ARM officials unveiled new CPU and GPU cores that they said delivered the performance and efficiency needed for new workloads like VR, AR, mobile gaming and machine learning. They also said that smartphones were becoming the portal through which such emerging technologies will run, putting greater pressure on the systems-on-the-chip (SoCs) powering these devices.