Intel is also working on a new programming language called Ct, which is meant to help develop new applications for multicore chips.
Intel recently joined Microsoft in donating $20 million to help develop a new generation of programmers who write applications that work in parallel, which Bautista said is critical as chip technology becomes more complex with each new generation.
On the hardware side, he said his research team is working to overcome some of the bandwidth limitations with such large-scale processors. Bautista said Intel has been meeting with various DRAM (dynamic RAM) suppliers to overcome the current limitations when it comes to supplying enough bandwidth.
One way that Intel might overcome this is with chip stacking, where the DRAM chips are stacked one atop another. Bautista also is investigating ways to increase the cache sizes and place those caches within millimeters of the CPU.
In the last week, IBM announced that it had developed a technique to water cool its three-dimensional chip stacks. Bautista said he saw the IBM results, but Intel had other plans for cooling chips in the tera-scale era.
"What we want to try to do is make the CPU more power-efficient at the start," he said.