Intel CEO Krzanich Talks IoT, Wearables, Smart Devices at IDF

 
 
By Jeffrey Burt  |  Posted 2015-08-18 Print this article Print
 
 
 
 
 
 
 
Intel Developer Forum


Intel and Google also are developing a technology that will reduce audio latency in applications and will be integrated into Google's Android Lollipop OS.

In the IoT and wearable spaces, Intel unveiled a software platform for the Curie module, which includes the Intel Quark system-on-a-chip (SoC) as well as the hardware, firmware, software and application software-development kit (SDK) that developers can use to build new devices.

The chip maker is working with Microchip and Amtel in implementing Intel's Enhanced Privacy Identification (EPID) technology in IoT sensor and microcontrollers to improve security and privacy in connected devices.

Krzanich also showed off the Memory Mirror—a connected mirror—created by Memomi that is being used in several Niemen Marcus stores and that lets users change the color of the clothing they're wearing without actually having to change the clothing. In a demonstration, an Intel rep changed the coloring of a red jacket in the mirror. The company also showed off an Intel-developed clip for baby car seats that alerts users when they leave the car and the baby is still in the seat in the vehicle.

A connected vending machine, developed by N&W, also leverages RealSense and allows users to order through use of gestures instead of having to touch the machine. N&W is planning to roll out 5,000 of these machines though 2016.

The Fossil Group, which Intel has been working with for more than a year to develop connected wearable devices based on Intel technology, showed off new products, including bracelets for both men and women and a watch that runs Google's Android Wear OS. These are expected to be available in the fourth quarter.

For the data center, Intel introduced Optane, a technology based on the chip maker's 3D XPoint non-volatile memory architecture, which was developed with Micron and introduced last month. The new memory chips will be up to 1,000 times faster and have 1,000 times more endurance than NAND, and will be 10 times denser than conventional DRAM.

Optane will combine 3D XPoint with Intel's system memory controller, interface hardware and software, and should first appear in new Intel solid-state drives (SSDs) next year. It also should appear in a new line of Intel DIMMs. Krzanich and Rob Crooke, senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group, demonstrated the Optane technology onstage.



 
 
 
 
 
 
 
 
 
 
 
 
 

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