Qualcomm Partners Testing HSPA+ and 3G, LTE Chips

Published: Nov 12, 2009
Updated: Feb 2, 2021
2 minute read
eWeek Le contenu et les recommandations de produits sont indépendants de la rédaction. Nous pouvons gagner de l'argent lorsque vous cliquez sur des liens vers nos partenaires. En savoir plus

Qualcomm is now providing customers with trial versions of its newly developed multimode, high-speed wireless chips.

The Mobile Data Modem, or MDM8220, is the first to support DC-HSPA+ (Dual-Carrier High-Speed Packet Access Plus), while the MDM9200 and MDM9600, according to Qualcomm, are the industry’s first multimode chip sets for 3G and LTE (Long Term Evolution).

The dual-mode chips enable customers to take advantage of higher-speed technology where it’s available, while being backward-compatible with prevailing technology.

“These chip sets demonstrate significant progress toward enabling the mass-market commercial deployment of two next-generation technologies that bring more advanced data capabilities to mobile devices for new global markets in addition to North America,” said a Nov. 12 Qualcomm statement.

LTE is a 4G technology competing with WiMax. In August, Verizon Wireless completed its first successful LTE 4G data calls, and plans to launch LTE in 30 markets in 2010.

HSPA+ is a 3.5G technology, though on Nov. 11 T-Mobile announced the launch of a trial HSPA+ network and that some initial tests showed faster speeds than those claimed by early 4G providers.

Qualcomm said devices based on its MDM solutions are scheduled to go on sale in the second half of 2010, and it’s working with manufacturers including Huawei, LG Electronics, Novatel Wireless, Sierra Wireless and ZTE, as well as infrastructure vendor Nokia Siemens, and network operators Emobile and Telestra Wireless.

“We are pleased to be working with so many industry leaders to bring these advanced technologies to market,” Alex Katouzian, vice president of product management for Qualcomm CDMA Technologies, said in a statement. “We remain committed to CDMA and OFDMA WAN modem leadership and the seamless and cost-effective commercialization of next-generation technologies around the world.”

Qualcomm describes the dual-carrier technology as doubling networks’ bandwidth from 5MHz to 10MHz by aggregating two HSPA carriers in parallel. The MDM8220 DC-HSPA+ solution reportedly provides downlink data rates of up to 42M bps and 11M bps on the uplink.

Michelle Maisto

Michelle Maisto has been covering the enterprise mobility space for a decade, beginning with Knowledge Management, Field Force Automation and eCRM, and most recently as the editor-in-chief of Mobile Enterprise magazine. She earned an MFA in nonfiction writing from Columbia University.

eWeek Logo

eWeek has the latest technology news and analysis, buying guides, and product reviews for IT professionals and technology buyers. The site's focus is on innovative solutions and covering in-depth technical content. eWeek stays on the cutting edge of technology news and IT trends through interviews and expert analysis. Gain insight from top innovators and thought leaders in the fields of IT, business, enterprise software, startups, and more.

Propriété de TechnologyAdvice. © 2026 TechnologyAdvice. Tous droits réservés

Divulgation publicitaire : Certains des produits qui apparaissent sur ce site proviennent d'entreprises dont TechnologyAdvice reçoit une compensation. Cette compensation peut influencer la façon dont les produits apparaissent sur ce site, notamment l'ordre dans lequel ils apparaissent. TechnologyAdvice n'inclut pas toutes les entreprises ou tous les types de produits disponibles sur le marché.