Low-Power PCI Express Spec to Debut

執筆者
eWEEK EDITORS
eWEEK EDITORS
Published: Sep 15, 2003
Updated: Feb 2, 2021
2 minute read
eWeek のコンテンツおよび製品のおすすめは、編集上の独立性を保っています。パートナーへのリンクをクリックすると、当社が報酬を得る場合があります。 詳細を見る

At the Intel Developer Forum this week, the PCI Special Interest Group (PCI SIG) will debut a low-power version of the PCI Express specification, a signal the technology will eventually arrive in notebooks.

PCI Express represents a fundmental reworking of the PCI architecture, which provides the peripheral data channel connecting the PCs CPU and chipset to the rest of the devices within the system. The technology is not backwards-compatible to traditional PCI, although early PCI Express motherboards will provide bridge chips to allow some PCI cards to be used.

The low-power addendum to the PCI Express specification will be unveiled this week at the Intel Developer Forum in San Jose, where Intel executives are expected to talk more about how its chipsets will support the PCI Express specification. Although neither Intel nor the PCI SIG would disclose when low-power products would be available, they would likely emerge a year or so after PCI Express rolls out in 2004.

The first use of PCI Express will be in graphics, where a x16 card will be designed for use inside the chassis. OEMs will also have the option of inserting “NewCards” in modules outside the box; “NewCards” are the temporary working name of a x1 modular card design that will house external hard drives, flash card readers, networking equipment, and other low-bandwidth devices.

The “NewCard” specification is expected to get a new coat of paint this week, with members describing how the devices will be marketed.

“The release of the Mobile Graphics Low-Power Addendum is yet another proof-point of the flexibility and growing relevance of the PCI Express architecture in multiple market segments and applications,” said Ajay Bhatt, chair of the PCI-SIG PCI Express steering committee, in a statement. “This addendum allows mobile platform architects to take advantage of lower thermal design points in optimizing for a low-swing transmitter and a shorter interconnect in designing their systems.”

For the full story click here

eWEEK EDITORS

eWeek editors publish top thought leaders and leading experts in emerging technology across a wide variety of Enterprise B2B sectors. Our focus is providing actionable information for today’s technology decision makers.

eWeek Logo

eWeek has the latest technology news and analysis, buying guides, and product reviews for IT professionals and technology buyers. The site's focus is on innovative solutions and covering in-depth technical content. eWeek stays on the cutting edge of technology news and IT trends through interviews and expert analysis. Gain insight from top innovators and thought leaders in the fields of IT, business, enterprise software, startups, and more.

TechnologyAdvice が所有・運営しています。 © 2026 TechnologyAdvice. 無断転載を禁じます

広告主に関する開示:このサイトに掲載されている製品の一部は、TechnologyAdvice が報酬を受け取っている企業のものです。この報酬は、製品がこのサイトのどこにどのように表示されるか(表示される順序など)に影響する場合があります。TechnologyAdvice は、市場で入手可能なすべての企業やすべての種類の製品を掲載しているわけではありません。