Toshiba’s America Electronic Components division on June 17 announced that it has finalized a capacious new 128GB embedded NAND flash memory module for use in smartphones, tablet PCs and digital video cameras.
The new module features the highest storage capacity seen thus far in the sector. The device integrates 16 64-gigabit (equal to 8GB) NAND chips fabricated with Toshiba’s 32nm process technology and a dedicated controller.
Everything is contained in a fully compliant, e-MMC-standard package that measures only 17x22x1.4 millimeters, Toshiba said.
Toshiba, the second-largest producer of NAND flash memory in the world behind Samsung, claimed to be the first company to succeed in combining 16 64-Gbit NAND chips. It used its advanced chip-thinning and layering technologies to produce individual chips that are only 30 micrometers thick, the company said.
Samples for OEMs will be made available for shipping in September, Toshiba said. Mass production will start in the fourth quarter of the year, when the company also will start making a 64GB variant, the company said.