Intel, DoCoMo to Co-Develop 3G Handset Chips | eWeek

Intel, DoCoMo to Co-Develop 3G Handset Chips

Written By
eWEEK EDITORS
eWEEK EDITORS
Nov 16, 2003
1 minute read
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NTT DoCoMo Inc. and Intel Corp. have agreed to develop semiconductors for 3G phones. The energy-efficient, low cost chips will carry out multiple tasks including image processing and data transmission. The companies will also jointly develop technology for fourth generation service, which is expected to be available as early as 2010.

Read the full story at Forbes.com

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