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By Mark Hachman  |  Posted 2004-09-08 Print this article Print
 
 
 
 
 
 
 


In 2005, Intels enterprise will once again be split between its Itanium and Xeon processors. The problem is that Intel is being much more forthcoming with its Itanium road map than its Xeon processors. For example, Intels low-voltage, dual-socket-capable Itanium 2 and "Fanwood" low-voltage processor will give way to two processors, the Millington and the dual-socket capable Montvale chip. Both cores will have low-voltage skews, Talwalkar said. The Montvale will also be available in a multisocket configuration, splitting time with the Montecito, Intels first dual-core chip. Both Itaniums will be supported by the E8870 chip set. Beyond 2005, Intel will ship the "Dimona" dual-socket Itanium core and the "Tukwila" for multiway systems.
Intels "Bayshore" program was canceled a short time ago, Talwalkar said, sacrificed to bring the Xeon and Itanium platforms closer together in 2006 and 2007.
Intels Xeon road map is much less clear. The Xeon MP line will yield the Cranford, Potomac and Tulsa processors in 2005, based on the Twin Castle chip set. Future Xeons will include the "Whitefield" processor. Whitefield was primarily designed in India, Talwalkar said, although he declined to comment on whether it will lift low-power technology from Intels low-voltage mobile chips. However, Intel flatly refused to publicly disclose the next-generation Xeon or supporting chip set beyond early 2005, when the Irwindale, a Nocona Xeon chip with a larger 2MB of cache, will ship. When asked, an Intel spokeswoman told a reporter that she "would get back to him on that." Intel did not disclose which of its processors would be dual-core enabled. The road map, however, did outline a laundry list of technologies that could be included: the Pellston cache error-checking technology; the Foxton performance-boosting technology; Dothan-style power management; Silvervale; and the new iAMT technology. According to the road map displayed by Talwalkar, the Vanderpool virtualization, multicore, and enhanced I/O and memory were listed under "future technologies." Behind the scenes, however, Intel is working with OEMs and other partners to make its new technologies a reality. "Make no mistake, software developers and engineers are working to develop a working ecosystem with us," Intels Brace said. Check out eWEEK.coms Infrastructure Center for the latest news, views and analysis on servers, switches and networking protocols for the enterprise and small businesses.


 
 
 
 
 
 
 
 
 
 
 

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