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Asetek, CoolIT Unveil Liquid Cooling Products for HPC

At the ISC 2016 show in Germany, the companies are introducing new cooling technologies and showcasing OEM systems that use liquid cooling.

data center

Liquid-cooling technologies for data center systems will be on display during this week's International Supercomputing show.

Officials with Asetek and CoolIT Systems have said both companies will put new products on display and demonstrate their offerings with OEM partners like Dell, Hewlett Packard Enterprise (HPE), Lenovo, Huawei Technologies, Fujitsu and Nvidia.

At the show, which runs this week in Frankfurt, Germany, Asetek will show off its InRackCDU cooling solution, which officials are saying offers customers the option of having the liquid cooling capabilities of the company's RackCDU product mounted in the server rack. InRackCDU has the same monitoring features found in Asetek's VerticalRackCDU product, but it doesn't take up any aisle space in the data center.

Asetek also will showcase offerings from a broad array of system makers—including Penguin, Fujitsu and Cray—that are being used in high-performance computing (HPC) environments. The company also will put on display liquid cooling solutions for IBM Power and OpenPower systems and Nvidia's Tesla P100 GPU accelerator—which is based on the chip maker's Pascal architecture—and node-level liquid cooling for Intel's Xeon Phi "Knights Landing" many-core processors.

Asetek is using its RackCDU D2C (Direct-to-Chip) technology with the Tesla P100, which Nvidia unveiled in April at its GPU Technology Conference and aimed at data center, cloud and hyperscale environments.

"Asetek's liquid cooling solution for the Tesla P100 lets HPC and data center OEMs benefit from huge boosts in server density and dramatic reductions in cooling costs," John Hamill, vice president of worldwide sales and marketing for Asetek, said in a statement.

For its part, CoolIT will release its newest CDU (cooling distribution unit), the CHx80 Heat Exchange Module, and its EP2 Active and RP2 Passive Coldplate Assemblies designed for Intel's Xeon Phi Knights Landing chips. The company also will showcase systems that use CoolIT's technologies from such OEMs as HPE, Dell, Huawei and Lenovo.

A growing number of system makers are looking at liquid cooling for some of their systems. Most recently, Dell unveiled "Triton," a system that uses water to cool servers that can be used in hyperscale environments. Water is attractive for some data centers because it can transport heat 25 times more efficiently than air.