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    Intel Takes Aim at IT with Virtualization, Management Capabilities

    Written by

    Jeff Burt
    Published March 1, 2005
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      SAN FRANCISCO—Intel will continue to push performance increases in the data center through the integration of technologies in the silicon, according to Pat Gelsinger, senior vice president and general manager of the chip makers Digital Enterprise Group.

      During his keynote here at the Intel Developer Forum Tuesday afternoon, Gelsinger said Intel Corp. eventually will put the technology—from greater management capabilities to virtualization features—into its entire line of processors.

      “Our goal: Put embedded IT capabilities in every platform we build,” Gelsinger said.

      The platform approach is key to Intels new strategy to continue to push forward Moores Law with new technologies rather than simply pushing the chips frequency.

      Those capabilities include Intel Virtualization Technology—formerly called “Vanderpool”—that will bring virtualization to the processor level. It will appear in desktop Pentium 4 chips and 64-bit Itanium server processors this year, and the Xeon DP and MP chips next year.

      A number of industry players at IDF have announced support for the virtualization technology, including VMWare Inc., Novell Corp. and Red Hat Inc.

      /zimages/2/28571.gifClick here to read more about Intels upcoming dual-core chips.

      Other technologies include I/O Acceleration Technology—for faster data flow between server applications and the network—and Active Management Technology, which enables users to remotely monitor and fix problems.

      In addition, dual-core processors also will bring greater performance without significantly increasing energy consumption or heat generation.

      Intels security technology, code-named LaGrande, is scheduled to begin appearing in Intel chips in 2006.

      Gelsinger said the new technologies are designed to give users a competitive advantage. “We see the difference between winning and losing is increasingly small in business,” he said.

      During his keynote, Gelsinger also gave more details on Intels product roadmap, which increasingly focuses on platforms rather than simply on chips. “Montecito,” the first dual-core Itanium 2 chip for multichip servers due out in late 2005, will be followed by “Montvale” in 2006 and the “Richford” platform after that, which will include the “Tukwila” chip in 2007 and “Poulson” after that.

      “Millington,” the Itanium 2 for dual-processor systems, will come out with Montecito, followed by “DP Montvale” next year and “Dimona” after that.

      Intel later this month will roll out the “Truland” platform, which will include the first 64-bit-enabled Xeon MP chip, followed by the “Paxville” and “Tulsa” chips next year. “Reidland” will follow after 2006, which will include the “Whitefield” chip.

      The “Bensley” platform, with the “Dempsey” chip and “Blackford” chip set, will roll out next year.

      Gelsinger demonstrated a number of these processors on stage, including Montecito and Dempsey.

      /zimages/2/28571.gifRead more here about Intels product roadmap.

      Appearing onstage with Gelsinger was Jim Allchin, group vice president for Microsoft Corp.s Platforms Group, who told the audience that the Redmond, Wash.-based company will support Intels I/O Accleration, virtualization, and 64-bit and multicore processors in future Windows releases. Microsofts 64-bit version of Windows is due next month, said Allchin.

      Gelsinger also said Intel will push 64-bit computing. He expects that 100 percent of server processors shipped by the end of 2006 will be 64-bit enabled, and more than half of the client chips will be 64-bit.

      “The message is … develop for 64-bit now,” he said.

      /zimages/2/28571.gifCheck out eWEEK.coms for the latest news in desktop and notebook computing.

      Jeff Burt
      Jeff Burt
      Jeffrey Burt has been with eWEEK since 2000, covering an array of areas that includes servers, networking, PCs, processors, converged infrastructure, unified communications and the Internet of things.

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