Qualcomm Targets Wearables With New Snapdragon SoC, Platform - Page 2

In addition, Qualcomm introduced the Snapdragon X16 LTE modem built using a 14-nanometer FinFET process. The modem is a Gigabit-class LTE chipset that officials said offers fiber-like download speeds of up to 1G bps, and pairs with the new WTR5975 RF transceiver, It's the first offering in the company's new modem architecture that offers modular designs and common software and targets a range of connected wireless devices, from smartphones and tablets to connected cars, drones and virtual reality headsets.

"Not only does the Snapdragon X16 blur the lines between wired and wireless broadband, but marks an important step toward 5G as we enable deeper unlicensed spectrum integration with LTE and more advanced MIMO [multiple input, multiple output] techniques to support growing data consumption and deliver an even faster and smoother user experience," Cristiano Amon, executive vice president of Qualcomm Technologies and president of Qualcomm CDMA Technologies, said in a statement.

The first commercial products are due in the second half of the year.

Qualcomm also introduced three new Snapdragon smartphone SoCs—the 625, 435 and 425—that include a number of custom technologies that touch on camera, video, gaming and connectivity, officials said.

The chips all include dual-camera image signal processors (ISPs), Qualcomm's truSignal technology for better call reliability, Hexagon digital signal processors for power-efficient audio and Quick Charge. They support 802.11ac with multi-user-MIMO and LTE with carrier aggregation. The Snapdragon 625 uses a 14nm FinFET technology that provides a 35 percent power consumption improvement over its predecessor and includes an eight-core ARM Cortex-A53 CPU, Qualcomm's Adreno 506 GPU and X9 LTE modem.

The Snapdragon 435 also uses an eight-core ARM CPU, an Adreno 505 GPU and an X8 LTE modem, while the Snapdragon 425 offers a 64-bit quad-core Cortex-A53 CPU, Adreno 308 GPU and high-definition display at 60 frames a second.

The chips will sample to customers in the middle of the year and will begin appearing in devices in the second half.