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    Globalfoundries Gains Qualcomm as a Customer

    By
    Jeff Burt
    -
    January 8, 2010
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      Globalfoundries, the chip manufacturing business spun out in 2009 by Advanced Micro Devices, is continuing to move beyond AMD by entering into a deal with mobile chip maker Qualcomm.

      The memorandum of understanding between the two companies, announced Jan. 7, makes Qualcomm Globalfoundries’ largest customer outside of AMD.

      Globalfoundries currently has STMicroelectronics as a customer, though that company operates some of its own fabs as well. Qualcomm is a fabless company, working instead with a variety of foundry partners in a strategy it calls IFM (Integrated Fabless Manufacturing).

      That strategy ensures Qualcomm a reliable supply of products and gives the company flexibility to adapt depending on customer demands, according to Qualcomm officials.

      The deal with Globalfoundries will give Qualcomm access to low-power 45-nanometer and 28-nm technologies. Globalfoundries will build products focusing on Qualcomm’s wireless businesses, including for products that support its CDMA2000, WCDMA (Wideband Code Division Multiple Access) and 4g/LTE wireless standards.

      Globalfoundries and Qualcomm also will partner in other areas, such as die-package interaction and three-dimensional packaging technologies.

      The companies say Globalfoundries will begin getting Qualcomm designs at its fab in Dresden, Germany, sometime in 2010.

      Its has been a busy year for Globalfoundries since spinning off from AMD. The company has broken ground on a $4.2 billion fabricating facility in upstate New York, and brought in STMicroelectronics as a customer.

      In addition, Globalfoundries is buying Chartered Semiconductor Manufacturing for $1.8 billion, which analysts say will make Globalfoundries a more competitive rival to the Taiwan-based manufacturers.

      Avatar
      Jeff Burt
      Jeffrey Burt has been with eWEEK since 2000, covering an array of areas that includes servers, networking, PCs, processors, converged infrastructure, unified communications and the Internet of things.

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